Research Fellow in Structural Integrity Brunel University London, College of Engineering, Design and Physical Sciences United Kingdom

Research Fellow - FAC0078


College / Directorate
College of Engineering, Design & Physical Sciences
Full Time / Part Time
Full Time
Posted Date
Closing Date
Ref No
  • Job Description
    (PDF, 347.31kb)


College: Engineering, Design and Physical Sciences


Department: Brunel Innovation Centre


Institute: Materials and Manufacturing


Theme: Structural Integrity


Job title: Research Fellow     


Vacancy Ref: FAC0078          


Salary (R1): £28,936 to £38,833 per annum plus £2,166 London Weighting per annum


Full-Time, Fixed Term (2 years)


The Brunel Innovation Centre (BIC) is a university research centre located at TWI’s facilities in Cambridge. BIC has been created to carry out research and development in the field of Non-Destructive Testing (NDT) and associated technologies such as sensors and systems for Structural Health Monitoring (SHM) and Condition Monitoring (CM). For more info on BIC, visit


BIC has recently been awarded funding by the European Commission to work with companies across Europe in the energy, aerospace and construction & engineering sectors to name a few and is seeking to recruit a Research Fellow.


TWI is a membership based organisation specialising in welding and joining, engineering and materials across a wide range of industry sectors whose activities include provision of advice, consultancy, research and development, inspection and training services. TWI has vast experience in collaborating with third parties, winning and delivering research grants and running shared research and technology facilities.


The objectives of these posts are to conduct research in the fields of structural integrity specifically NDT, SHM and CM. The posts will involve work in one of more of the following fields:

  • Programming sophisticated data mining analysis and pattern recognition techniques algorithms in Matlab, Labview and C:Development of acquisition and control hardware systems based on NI DAQs, STM32, FPGA and Rasp berry Pi.

    • Development of Artificial Intelligence and Neural Networks for defect location, clustering and classification
    • Use of advanced image processing algorithms (filtering, thresholding) for automated NDT inspection (ultrasonic, radiofrequency)
  • Electronics and computer interfacing.

  • Sensors and transducers design and development (e.g. ultrasonics, acoustic emission).

  • Mechanical and electrical system integration.


The successful candidates will have:

  • A relevant degree or equivalent.

  • Be appropriate for PhD or equivalent registration or have a PhD.

  • Evidence of sufficient knowledge in the above mentioned discipline and of research methods.

  • Evidence of the ability to acquire and interpret research data and results.

  • Good communication and presentation skills and the ability to draft research papers for publication in academic journals and/or combination of industrial experience and/or training.

  • Excellent analytical capability.


Closing date for applications: 30/10/2017


For further details and to apply please visit

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